压痕测试法的新发展

K.赫尔曼[1] 王兰州[2]（翻译/整理）
[1]德国联邦物理技术研究院,德国 布伦瑞克市 [2]不详
摘　要:介绍了压痕测试法的最新发展,指出了确定超薄薄膜t＜10 nm及很硬的薄膜t＜100 nm的硬度及模量是对计量学中纳米范围的挑战.以压痕测试法替代显微维氏实验可显著地降低测量不确定度及实现自动化.压痕测试法在纳米范围及显微范围内可为微电子学、微电机械系统、技术光学等领域采用.[著者文摘]

New developments of the instrumented indentation testK. Herrmann Physikaliseh-Teehnisehe Bundesanstalt Braunscheig, GermanyAbstract:An advance of the instrumented indentation test （IIT） in recent years has been introduced in this work. It indicates a metrological challenge in the nano range-determination of hardness and modulus on ultrathin layers t〈10 nm and of very hard layers t~100 nm. Substitution of micro Vickers test by IIT enables signifi- cant reduction of measurement uncertainty and automatization. IIT in nano and micro ranges provides manifold applications for microelectronics, MEMS, technical optics, etc.[著者文摘]

Key words:indentation, the instrumented indentation test （IIT） ; uncertainty; metrology